Punto d'origine
Guangdong, China
Materia prima principale
Resina epossidica
Uso
Costruzione, Imballaggio, memory card, CCD or CMOS assembly
Altri Nomi
Sensitive devices low temperature epoxy adhesive
Classificazione
Altri adesivi
Numero del Modello
DM-6109
Tipo
Sensitive devices low temperature epoxy adhesive
Product name
Sensitive devices low temperature epoxy adhesive potting material
Product type
Low temperature curing epoxy adhesive
Use
for electrical appliances, for MEMS
Product Description
With any temperature and thermal treatment, matt excellent adhesion
Curing system
has good adhesion to a variety of materials in a very short time
Application scenario
CMOS and other temperature sensitive devices are bonded
Curing conditions
10min@80℃