Punto d'origine
Guangdong, China
Materia prima principale
Resina epossidica
Uso
Costruzione, CMOS and other temperature sensitive devices are bonded
Classificazione
Altri adesivi
Numero del Modello
DM-6120
Product name
Low temperature epoxy adhesive
Characteristic
With any temperature and thermal treatment, matt excellent adhesion
Curing conditions
5-10min@80°C
Application
CMOS and other temperature sensitive devices are bonded