Punto d'origine
Guangdong, China
Materia prima principale
Resina epossidica
Uso
Costruzione, Imballaggio, TV and Camera
Altri Nomi
Best potting compound epoxy primer
Classificazione
Altri adesivi
Numero del Modello
DM-6307
Tipo
Best potting compound epoxy primer
Product name
Best potting compound epoxy primer
Use
for filling applications, underfill flip-chip
Product Description
High Tg, fast at medium temperature Curing, good electrical stability
Curing system
Fast curing at low temperature
Application scenario
Chip bottom filling
Curing conditions
10min @100℃